Heat dissipating device and manufacturing method of heat dissipating device
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United States of America Patent
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Jun 12, 2018
Issued Date -
Jan 1, 2015
app pub date -
Dec 19, 2013
filing date -
Jun 27, 2013
priority date (Note) -
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Abstract
A heat dissipating device includes a heat dissipating module, a heat pipe, and an injection molded member formed by molding and solidifying. The heat pipe has a transfer segment, a heat input segment, and a heat output segment. The heat input segment and the heat output segment are respectively integrally extended from two opposite ends of the transfer segment. The heat input segment and the heat output segment each has a contact surface, and at least one of the contact surfaces contacts the heat dissipating module. The injection molded member connects to the heat dissipating module and a portion of the heat pipe, which contacts the heat dissipating module, for keeping the connection of the heat dissipating module and the contact surface of the heat pipe. The instant disclosure also provides a manufacturing method of the heat dissipating device by using connection of the injection molded member.
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