Methods of forming one or more covered voids in a semiconductor substrate
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United States of America Patent
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Jun 12, 2018
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app pub date -
Aug 23, 2017
filing date -
Feb 7, 2007
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Abstract
Some embodiments include methods of forming voids within semiconductor constructions. In some embodiments the voids may be utilized as microstructures for distributing coolant, for guiding electromagnetic radiation, or for separation and/or characterization of materials. Some embodiments include constructions having micro-structures therein which correspond to voids, conduits, insulative structures, semiconductor structures or conductive structures.
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