Bond head assemblies, thermocompression bonding systems and methods of assembling and operating the same

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United States of America Patent

PATENT NO 9997383
APP PUB NO 20170117168A1
SERIAL NO

15398420

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Abstract

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A bond head assembly for bonding a semiconductor element to a substrate is provided. The bond head assembly includes a base structure, a heater, and a clamping system securing the heater to the base structure. The clamping system includes a plurality of elastic elements constraining the heater along a plurality of axes.

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Patent Owner(s)

Patent OwnerAddress
KULICKE AND SOFFA INDUSTRIES INC1005 VIRGINIA DRIVE FORT WASHINGTON PA 19034

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Wasserman, Matthew B Philadelphia, US 24 92

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