Layered structure with conductive polymer for recognition of manipulation and process for the production thereof
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United States of America Patent
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Jun 12, 2018
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N/A
app pub date -
Mar 31, 2014
filing date -
Apr 2, 2013
priority date (Note) -
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status (Latency Note)
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Abstract
The invention relates to a layered structure (10) comprising the following layers: a) a first substrate layer (2), wherein the first substrate layer (2) has a first surface (4) and a second surface (6) and is configured as a dielectric; b) a first electrically conductive layer (8) which overlaps at least in part the first substrate layer (2) at least on the first surface (4) of the first substrate layer (2), wherein the first electrically conductive layer (8) comprises an electrically conductive polymer, wherein the first electrically conductive layer (8) has at least one first part region (18) and at least one further part region (20), wherein the at least one first part region (18) has a higher bonding strength to the substrate layer (2) than to the at least one further part region (20).
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International Classification(s)
- B41M:PRINTING, DUPLICATING, MARKING, OR COPYING PROCESS....
- G06Q:DATA PROCESSING SYSTEMS OR METHODS, SPECIALLY ADAP....
- G06F:ELECTRIC DIGITAL DATA PROCESSING
- B42D:BOOKS; BOOK COVERS; LOOSE LEAVES; PRINTED MATTER O....
- G06K:RECOGNITION OF DATA; PRESENTATION OF DATA; RECORD ....
- B32B:LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA....
- H05K:PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAIL....
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