PCB module for increased connectivity
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United States of America Patent
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Jun 12, 2018
Issued Date -
N/A
app pub date -
Mar 31, 2016
filing date -
May 22, 2015
priority date (Note) -
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Abstract
A printed circuit board (PCB) module that includes a processor package, an upper PCB and a lower PCB. The processor package includes a processor substrate and a processor. An upper socket is disposed on a lower surface of the upper PCB, and the upper socket electrically connects to a top electrical interface on the upper surface of the processor substrate. The lower PCB electrically interfaces with a bottom electrical interface on a lower surface of the processor substrate.
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