Active-light-sensitive or radiation-sensitive resin composition, pattern forming method, and method for manufacturing electronic device
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United States of America Patent
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Jun 12, 2018
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app pub date -
Jan 6, 2017
filing date -
Jul 9, 2014
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Abstract
Provided are an active-light-sensitive or radiation-sensitive resin composition having high depth of focus and excellent resolving power; a pattern forming method using the composition; and a method for manufacturing an electronic device. The composition is an active-light-sensitive or radiation-sensitive resin composition containing a resin (P), in which the resin (P) includes a repeating unit (a) having an acid-decomposable group and a repeating unit (b) having a lactone structure and the like; the repeating unit (a) includes at least a specific repeating unit (a1) represented by General Formula (1); the content of the repeating units (a1) with respect to all the repeating units of the resin (P) is 35% by mole or more; and the resin (P) does not include any of a specific group represented by General Formula (X1), a specific structure represented by General Formula (X2), a hydroxyadamantyl group, and a hydroxyadamantyl group in which a hydroxy group is protected with a group that decomposes by the action of an acid to leave.
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