Slurry composition for polishing tungsten

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United States of America Patent

PATENT NO 9994735
SERIAL NO

15189190

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Abstract

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A slurry composition for polishing tungsten is provided. The slurry composition for polishing tungsten may include a water-soluble polymer, abrasive particles and an etching adjuster.

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Patent Owner(s)

Patent OwnerAddress
KCTECH CO LTD30 JE2GONGDAN 3-GIL MIYANG-MYEON ANSEONG-SI GYEONGGI-DO

International Classification(s)

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  • 2016 Application Filing Year
  • C09K Class
  • 3076 Applications Filed
  • 2094 Patents Issued To-Date
  • 68.08 % Issued To-Date
Click to zoom InYear of Issuance% of Matters IssuedCumulative IssuancesYearly Issuances20162017201820192020202120222023202420250255075100

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Hwang, Jin Sook Anseong-si, KR 5 2
Kong, Hyun Goo Anseong-si, KR 10 15
Park, Han Teo Anseong-si, KR 19 3

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  • 0 Citation Count
  • C09K Class
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  • 7 Age
Citation count rangeNumber of patents cited in rangeNumber of patents cited in various citation count ranges2915334913552101 - 1011 - 2021 - 3031 - 4041 - 5051 - 6061 - 700255075100125150175200225250275300325350375400425450475500525550575

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