Method for arranging fine particles on substrate by physical pressure
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United States of America Patent
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Jun 12, 2018
Issued Date -
N/A
app pub date -
Apr 9, 2010
filing date -
Apr 9, 2009
priority date (Note) -
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status (Latency Note)
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Abstract
Provided is a method of arranging particles on a substrate, the method including: (a) preparing a substrate, a surface of which has depressions or projections capable of fixing the positions and/or orientations of one or more particles; and (b) placing the particles on the substrate and applying a physical pressure to the particles so that a portion or the whole of each particle is inserted in each of pores defined by the depressions or the projections. Provided is also a method of arranging particles on a substrate, the method including: (a) preparing a substrate, at least a surface portion of which has adhesive property; and (b) placing particles, which do not have flat facets but curved surfaces, on the substrate and applying a physical pressure to the particles so that the particles are immobilized on adhesive surface portions of the substrate.
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International Classification(s)
- B05D:PROCESSES FOR APPLYING LIQUIDS OR OTHER FLUENT MAT....
- B82Y:SPECIFIC USES OR APPLICATIONS OF NANO-STRUCTURES; ....
- B81C:PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE M....
- C30B:SINGLE-CRYSTAL GROWTH
- G03F:PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNE....
- B32B:LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA....
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