Silver powder, method for producing same, and conductive paste
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United States of America Patent
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Jun 12, 2018
Issued Date -
N/A
app pub date -
Jul 27, 2015
filing date -
Jul 31, 2014
priority date (Note) -
In Force
status (Latency Note)
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Abstract
A silver powder, including: an organic substance on a surface of the silver powder, the organic substance containing at least one carboxyl group and at least one hydroxyl group in one molecule of the organic substance, wherein a BET specific surface area of the silver powder is 0.1 m2/g or more but 2.0 m2/g or less, and wherein a cumulative 50% point of particle diameter (D50) of the silver powder in a volume-based particle size distribution of the silver powder as measured by a laser diffraction particle size distribution analysis is 0.1 μm or more but 6.0 μm or less, and a ratio of [(D90−D10)/D50] is 3.0 or less, where D50 is the cumulative 50% point of particle diameter, D90 is a cumulative 90% point of particle diameter of the silver powder, and D10 is a cumulative 10% point of particle diameter of the silver powder.
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- 15 United States
- 10 France
- 8 Japan
- 7 China
- 5 Korea
- 2 Other
Patent Owner(s)
Patent Owner | Address | |
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DOWA ELECTRONICS MATERIALS CO LTD | JAPAN |
International Classification(s)
Inventor(s)
Inventor Name | Address | # of filed Patents | Total Citations |
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Kamiga, Hiroshi | Tokyo, JP | 12 | 23 |
# of filed Patents : 12 Total Citations : 23 | |||
Nakanoya, Taro | Tokyo, JP | 7 | 40 |
# of filed Patents : 7 Total Citations : 40 |
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