Silver powder, method for producing same, and conductive paste

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United States of America Patent

PATENT NO 9993871
SERIAL NO

15500192

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A silver powder, including: an organic substance on a surface of the silver powder, the organic substance containing at least one carboxyl group and at least one hydroxyl group in one molecule of the organic substance, wherein a BET specific surface area of the silver powder is 0.1 m2/g or more but 2.0 m2/g or less, and wherein a cumulative 50% point of particle diameter (D50) of the silver powder in a volume-based particle size distribution of the silver powder as measured by a laser diffraction particle size distribution analysis is 0.1 μm or more but 6.0 μm or less, and a ratio of [(D90−D10)/D50] is 3.0 or less, where D50 is the cumulative 50% point of particle diameter, D90 is a cumulative 90% point of particle diameter of the silver powder, and D10 is a cumulative 10% point of particle diameter of the silver powder.

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Patent Owner(s)

Patent OwnerAddress
DOWA ELECTRONICS MATERIALS CO LTDJAPAN

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Kamiga, Hiroshi Tokyo, JP 12 23
Nakanoya, Taro Tokyo, JP 7 40

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Citation count rangeNumber of patents cited in rangeNumber of patents cited in various citation count ranges144252276101 - 1011 - 2021 - 3031 - 40020406080100120140160180200220240260280

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