Method for manufacturing semiconductor laser device including wavelength converting member and light transmissive member
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United States of America Patent
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Jun 5, 2018
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N/A
app pub date -
Nov 15, 2016
filing date -
Jul 3, 2013
priority date (Note) -
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Abstract
The light emitting device according to the present invention comprises a laser diode; a wavelength converting member which is configured to convert a wavelength of a light emitted from the laser diode; and a support member which is configured to support the wavelength converting member so that the light passes through two surfaces of the wavelength converting member. The wavelength converting member comprises a fluorescent material and a binder. At least one light transmissive member is disposed on at least one of these two surfaces of the wavelength converting member. The binder has a melting point higher than a melting point of the light transmissive member. The light transmissive member is fixed to the support member by fusion bonding.
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