Encapsulation material for light emitting diodes
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
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Jun 5, 2018
Issued Date -
Jun 16, 2016
app pub date -
Jul 16, 2014
filing date -
Jul 19, 2013
priority date (Note) -
In Force
status (Latency Note)
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Abstract
The invention relates to the use of specific organopolysilazanes as an encapsulation material for light emitting diodes (LED). The organopolysilazane polymers act as insulating filling materials and are stable over temperature and over exposure to ambient UV radiation. The encapsulating material has good thermal stability against discoloration to yellow by aging even at high temperatures which is a key factor for the long lifetime of an LED encapsulant and the LED performance.
First Claim
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Family

- 15 United States
- 10 France
- 8 Japan
- 7 China
- 5 Korea
- 2 Other
Patent Owner(s)
- AZ ELECTRONIC MATERIALS (LUXEMBOURG) S.A.R.L.
International Classification(s)
Inventor(s)
Inventor Name | Address | # of filed Patents | Total Citations |
---|---|---|---|
Grottenmüller, Ralph | Wiesbaden, DE | 1 | 2 |
# of filed Patents : 1 Total Citations : 2 | |||
Karunanandan, Rosalin | Frankfurt am Main, DE | 3 | 8 |
# of filed Patents : 3 Total Citations : 8 | |||
Kita, Fumio | Wiesbaden, DE | 18 | 131 |
# of filed Patents : 18 Total Citations : 131 | |||
Lenz, Helmut | Eschborn, DE | 66 | 682 |
# of filed Patents : 66 Total Citations : 682 | |||
Wagner, Dieter | Wiesbaden, DE | 28 | 349 |
# of filed Patents : 28 Total Citations : 349 |
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Patent Citation Ranking
- 1 Citation Count
- C08J Class
- 40.10 % this patent is cited more than
- 7 Age
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Surcharge after expiration - Late payment is unintentional | $1,640.00 | $820.00 | $410.00 |
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