Semiconductor bonding with compliant resin and utilizing hydrogen implantation for transfer-wafer removal
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Jun 5, 2018
Issued Date -
N/A
app pub date -
Nov 5, 2015
filing date -
Sep 5, 2014
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A transfer substrate with a compliant resin is used to bond one or more chips to a target wafer. An implant region is formed in a transfer substrate. A portion of the transfer substrate is etched to form a riser. Compliant material is applied to the transfer substrate. A chip is secured to the compliant material, wherein the chip is secured to the compliant material above the riser. The chip is bonded to a target wafer while the chip is secured to the compliant material. The transfer substrate and compliant material are removed from the chip. The transfer substrate is opaque to UV light.
First Claim
Family
International Classification(s)
- [Classification Symbol]
- [Patents Count]
Cited Art Landscape
Patent Citation Ranking
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully