Electrostatic chuck having thermally isolated zones with minimal crosstalk
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United States of America Patent
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Jun 5, 2018
Issued Date -
Aug 31, 2017
app pub date -
May 15, 2017
filing date -
May 7, 2013
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Abstract
A substrate support assembly includes a ceramic puck and a thermally conductive base having an upper surface that is bonded to a lower surface of the ceramic puck. The thermally conductive base includes a plurality of thermal zones and a plurality of thermal isolators that extend from the upper surface of the thermally conductive base towards a lower surface of the thermally conductive base, wherein each of the plurality of thermal isolators provides approximate thermal isolation between two of the plurality of thermal zones at the upper surface of the thermally conductive base.
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