Method for etch-based planarization of a substrate
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Jun 5, 2018
Issued Date -
Feb 15, 2018
app pub date -
Aug 11, 2017
filing date -
Aug 11, 2016
priority date (Note) -
In Force
status (Latency Note)
Importance
Loading Importance Indicators... 
Abstract
Techniques herein provide an etch-based planarization technique. An initial film is deposited on a substrate. Deposition of this initial film results in a non-planar film because of differences in area density of underlying structures (for example, open areas compared to closely spaced trenches). Etch processes are executed that use a reverse lag RIE process to planarize the initial film, and then another coat of the film material can be deposited, resulting in a planar surface. Such techniques can planarized substrates without using chemical mechanical polishing (CMP).
First Claim
Other Claims data not available
Family
Loading Family data...
International Classification(s)
- 2017 Application Filing Year
- C03C Class
- 1122 Applications Filed
- 751 Patents Issued To-Date
- 66.94 % Issued To-Date
Cited Art Landscape
Patent Citation Ranking
- 3 Citation Count
- C03C Class
- 32.33 % this patent is cited more than
- 7 Age
Maintenance Fees
| Fee | Large entity fee | small entity fee | micro entity fee | due date |
|---|---|---|---|---|
| 7.5 Year Payment | $3600.00 | $1800.00 | $900.00 | Dec 5, 2025 |
| 11.5 Year Payment | $7400.00 | $3700.00 | $1850.00 | Dec 5, 2029 |
