Offset-printing method for three-dimensional package
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United States of America Patent
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Jun 5, 2018
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Dec 15, 2016
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Sep 1, 2011
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Abstract
The present invention discloses an offset-printing method for a three-dimensional 3D-oP (three-dimensional offset-printed memory)-based package. The mask-patterns for different 3D-op dice are merged onto a same data-mask. At different printing steps, a wafer is offset by different values with respect to the data-mask. Accordingly, data-patterns from a same data-mask are printed into different 3D-oP dice.
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