Image analysis methods for plated through hole reliability
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United States of America Patent
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Jun 5, 2018
Issued Date -
Nov 16, 2017
app pub date -
May 11, 2016
filing date -
May 11, 2016
priority date (Note) -
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Abstract
In some embodiments, methods include acquiring a micrograph image of a plated through hole and converting the micrograph image to a binary image. Methods include defining a pixel line at a copper-dielectric material interface of the binary image. In some embodiments, methods include comparing a length of an interface line compared to a length of a portion to determine a roughness of the pixel line. In some embodiments, methods include determining a roughness of the hole wall before copper plating. Methods may include determining a roughness of the interface using the pixel line.
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