Method and apparatus for testing interposer dies prior to assembly
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United States of America Patent
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Jun 5, 2018
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app pub date -
Sep 23, 2014
filing date -
Sep 23, 2014
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Abstract
A method and a probe device for testing an interposer prior to assembly are described herein. The method includes coupling a plurality of probe tips of a probe device to the plurality of signal interconnect paths of the interposer to be tested. A test signal is provided from the probe device to the plurality of signal interconnect paths of the interposer and a quality characteristic of signal interconnect paths of the interposer is detected based on behavior of the interposer in response to the test signal.
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