Substrate etch
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Jun 5, 2018
Issued Date -
N/A
app pub date -
Aug 30, 2013
filing date -
Aug 30, 2013
priority date (Note) -
In Force
status (Latency Note)
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Abstract
An example provides a method including sputtering a metal catalyst onto a substrate, exposing the substrate to a solution that reacts with the metal catalyst to form a plurality of pores in the substrate, and etching the substrate to remove the plurality of pores to form a recess in the substrate.
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International Classification(s)
- 2013 Application Filing Year
- H01L Class
- 22267 Applications Filed
- 20713 Patents Issued To-Date
- 93.03 % Issued To-Date
Cited Art Landscape
Patent Citation Ranking
- 0 Citation Count
- H01L Class
- 0 % this patent is cited more than
- 7 Age
Maintenance Fees
| Fee | Large entity fee | small entity fee | micro entity fee | due date |
|---|---|---|---|---|
| 7.5 Year Payment | $3600.00 | $1800.00 | $900.00 | Dec 5, 2025 |
| 11.5 Year Payment | $7400.00 | $3700.00 | $1850.00 | Dec 5, 2029 |
