Ovenable heat-sealed package
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United States of America Patent
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Jun 5, 2018
Issued Date -
Jul 3, 2014
app pub date -
Jul 22, 2011
filing date -
Aug 23, 2010
priority date (Note) -
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Abstract
A package comprises a heat seal between a first film and a second film. The first film comprises at least 70% of one or more polyamides. The first film also comprises at least one modified layer comprising (1) at least 70% of one or more polyamides and (2) one or more modifiers selected from ethylene/alkyl(meth)acrylate copolymers, ethylene/(meth)acrylic acid copolymers, and ionomers. The second film comprises at least 70%) of one or more polyamides. The package is useful under ovenable conditions.
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