Solderable conductive polymer thick film composition

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United States of America Patent

PATENT NO 9986650
SERIAL NO

14528527

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Abstract

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A conductive polymer thick film composition suitable for lead-free soldering comprising metallic particles and an organic vehicle comprising at least one phenolic resin and a solvent is provided. A method of soldering to the conductive polymer thick film composition of the invention is also provided. An article comprising a substrate and a cured polymer film on a surface of the substrate formed of the conductive polymer thick film composition of the invention is provided.

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Patent Owner(s)

Patent OwnerAddress
HERAEUS PRECIOUS METALS NORTH AMERICA CONSHOHOCKEN LLC24 UNION HILL ROAD WEST CONSHOHOCKEN PA 19428

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Grabey, Steven Hazleton, US 6 23
Shahbazi, Samson Roslyn, US 14 129

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