Heating element for SMD mounting
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United States of America Patent
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May 29, 2018
Issued Date -
N/A
app pub date -
Mar 29, 2016
filing date -
Mar 31, 2015
priority date (Note) -
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Abstract
The present disclosure relates to SMD mounting. The teachings thereof may be embodied in heating elements having a mounting side for SMD mounting, the mounting side being available for placing onto a substrate, for example in the form of a circuit carrier, electronic assemblies with a circuit carrier and a component, and/or methods for producing an electronic assembly having a circuit carrier and a component placed on the circuit carrier. For example, a heating element may include: a mounting side for SMD mounting; a housing enclosing a cavity; and a reactive substance in the cavity that reacts exothermically at a reaction temperature T1.
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