Method for manufacturing printed wiring board and printed wiring board
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United States of America Patent
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May 29, 2018
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app pub date -
Jul 22, 2016
filing date -
Jul 22, 2015
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Abstract
A method for manufacturing a printed wiring board includes forming, on a surface of an insulating layer, a patterned catalyst film including a catalyst for electroless plating such that the patterned catalyst film has a pattern corresponding to a conductor circuit, and applying electroless plating on the patterned catalyst film such that a conductor metal is deposited on the patterned catalyst film and that the conductor circuit is formed on the surface of the insulating layer.
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