Antenna apparatus and method
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United States of America Patent
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May 29, 2018
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app pub date -
Aug 16, 2016
filing date -
Dec 13, 2012
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Abstract
An antenna apparatus comprises a semiconductor die embedded in and adjacent to a first side of a molding compound layer, a plurality of first interconnects formed on the first side of the molding compound layer, wherein the plurality of first interconnects are electrically connected the semiconductor die and an antenna structure formed on a second side of the molding compound layer, wherein the antenna structure is electrically connected to the semiconductor die through a via connected between the plurality of first interconnects and the antenna structure.
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