Electrostatic chuck design for high temperature RF applications
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United States of America Patent
Stats
-
May 29, 2018
Issued Date -
N/A
app pub date -
Dec 8, 2015
filing date -
Dec 11, 2014
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
An electrostatic chuck includes a puck having a support surface to support a substrate when disposed thereon and an opposing second surface, wherein one or more chucking electrodes are embedded in the puck, a body having a support surface coupled to the second surface of the puck to support the puck, a DC voltage sensing circuit disposed on support surface of the puck, and an inductor disposed in the body and proximate the support surface of the body, wherein the inductor is electrically coupled to DC voltage sensing circuit, and wherein the inductor is configured to filter high frequency current flow in order to accurately measure DC potential on the substrate.
First Claim
Other Claims data not available
Family
International Classification(s)
- 2015 Application Filing Year
- H01L Class
- 25498 Applications Filed
- 22451 Patents Issued To-Date
- 88.06 % Issued To-Date
Cited Art Landscape
Patent Citation Ranking
- 2 Citation Count
- H01L Class
- 23.71 % this patent is cited more than
- 7 Age
Maintenance Fees
| Fee | Large entity fee | small entity fee | micro entity fee | due date |
|---|---|---|---|---|
| 7.5 Year Payment | $3600.00 | $1800.00 | $900.00 | Nov 29, 2025 |
| 11.5 Year Payment | $7400.00 | $3700.00 | $1850.00 | Nov 29, 2029 |
