Method for manufacturing a chip arrangement including a ceramic layer

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United States of America Patent

PATENT NO 9984897
SERIAL NO

15268674

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Abstract

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A chip arrangement is provided, the chip arrangement, including a carrier; a first chip electrically connected to the carrier; a ceramic layer disposed over the carrier; and a second chip disposed over the ceramic layer; wherein the ceramic layer has a porosity in the range from about 3% to about 70%.

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Patent Owner(s)

Patent OwnerAddress
INFINEON TECHNOLOGIES AGCAMPBELL 1-15 NAUBIBERG GERMANY NEUBIBERG BAVARIA

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Hosseini, Khalil Weihmichl, DE 90 609
Kalz, Franz-Peter Regensburg, DE 24 129
Mahler, Joachim Regensburg, DE 224 2135
Mengel, Manfred Bad Abbach, DE 68 753

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