Test socket for testing semiconductor chip package and method of manufacturing the same
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United States of America Patent
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May 29, 2018
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N/A
app pub date -
Jun 18, 2015
filing date -
Oct 21, 2014
priority date (Note) -
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Abstract
A test socket is provided that includes a base material including an insulating elastic material and a conductive portion extending through the base material in a thickness direction of the base material, wherein the conductive portion includes a plurality of conductive particle structures arranged in the thickness direction of the base material, and each of the plurality of conductive particle structures includes a plurality of conductive particles having at least one insulating wire and/or at least one conductive wire extending from a surface of the conductive particle, bonded with a material having a functional group.
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