Atomic source with heater on thermal isolation die
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United States of America Patent
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May 29, 2018
Issued Date -
N/A
app pub date -
Apr 9, 2014
filing date -
Feb 12, 2014
priority date (Note) -
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Abstract
In one embodiment, a chip scale atomic sensor is provided. The chip scale atomic sensor includes a body that defines at least one sensing chamber. The body includes a thermal isolation die mounted to the body. The thermal isolation die is disposed in a location that communicates with the at least one sensing chamber. The thermal isolation die includes a substrate defining a frame portion and an isolated portion and a plurality of tethers mechanically coupling the isolated portion of the substrate to the frame portion. The thermal isolation die also includes an atomic source mounted on the isolated portion of the substrate, and a heating element mounted on the isolated portion and configured to heat the atomic source.
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