Vaporization system

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United States of America Patent

PATENT NO 9982883
SERIAL NO

14952773

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Abstract

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The present invention makes it possible to reduce the size of a vaporization system by eliminating the need for conduits in the vaporization system, without it being necessary to form a flow path in order for a supply rate controller to be mounted inside a vaporizer, and is formed by a vaporizer that vaporizes a liquid material; a supply rate controller that controls a supply rate of the liquid material to the vaporizer; and a manifold block inside which an internal flow path is formed, and that has a device mounting surface on which both the vaporizer and the supply rate controller are mounted, wherein, as a result of the vaporizer and the supply rate controller being mounted on the device mounting surface, they are connected together via the flow path.

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Patent Owner(s)

Patent OwnerAddress
HORIBA STEC CO LTD11-5 HOKODATE-CHO KAMITOBA MINAMI-KU KYOTO-SHI KYOTO 601-8116

International Classification(s)

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  • 2015 Application Filing Year
  • F22B Class
  • 204 Applications Filed
  • 158 Patents Issued To-Date
  • 77.46 % Issued To-Date
Click to zoom InYear of Issuance% of Matters IssuedCumulative IssuancesYearly Issuances2015201620172018201920202021202220230255075100

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Hamada, Masashi Kyoto, JP 55 556
Taguchi, Akihiro Kyoto, JP 57 8041
Yada, Hidetaka Kyoto, JP 9 39

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Patent Citation Ranking

  • 0 Citation Count
  • F22B Class
  • 0 % this patent is cited more than
  • 7 Age
Citation count rangeNumber of patents cited in rangeNumber of patents cited in various citation count ranges13341101 - 1011 - 2021 - 30024681012141618202224262830323436

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