Thermocompression-bonding filament nonwoven fabric having excellent molding properties

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 9982375
SERIAL NO

14439753

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Abstract

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Provided is a thermocompression-bonding filament nonwoven fabric, which is inexpensive, has excellent molding properties and design properties, and is suitable as surface materials for automotive acoustic absorbing materials. The thermocompression-bonding filament nonwoven fabric comprising a polyester-based resin having a melting point of 250° C. or more, wherein the filament nonwoven fabric has a weight of 20 to 80 g/m2, a sum of 5% tensile loads in a MD and CD per weight of 1.0 to 1.9 (N/5 cm)/(g/m2), and a 180° C. dry heat shrinkage of 3.5% or less in both the MD and CD, and is not mechanically interlaced.

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Patent Owner(s)

Patent OwnerAddress
TOYOBO MC CORPORATIONOSAKA UMEDA TWIN TOWERS SOUTH 13-1 UMEDA 1-CHOME KITA-KU OSAKA-SHI OSAKA 530-0001

International Classification(s)

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  • 2013 Application Filing Year
  • D01F Class
  • 271 Applications Filed
  • 236 Patents Issued To-Date
  • 87.09 % Issued To-Date
Click to zoom InYear of Issuance% of Matters IssuedCumulative IssuancesYearly Issuances201320142015201620172018201920202021202220230255075100

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Koida, Takashi Osaka, JP 14 20
Minagawa, Naofumi Yamaguchi, JP 1 1
Sakamoto, Hiroyuki Shiga, JP 201 3157
Yoshida, Hideo Shiga, JP 223 1974

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Patent Citation Ranking

  • 1 Citation Count
  • D01F Class
  • 23.20 % this patent is cited more than
  • 7 Age
Citation count rangeNumber of patents cited in rangeNumber of patents cited in various citation count ranges4511919631101 - 1011 - 2021 - 3031 - 4041 - 5081 - 900102030405060708090100110120130

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