Silver-coated conductive particles, conductive paste and conductive film
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United States of America Patent
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May 29, 2018
Issued Date -
N/A
app pub date -
Dec 19, 2014
filing date -
Dec 20, 2013
priority date (Note) -
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status (Latency Note)
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Abstract
Provided are highly reliable silver-coated conductive particles, which are prevented from an occurrence of migration, the silver-coated conductive particles in which: a tin layer is formed on a surface of each spherical base particle, and a silver plating layer is formed on a surface of the tin layer, and a surface of the silver plating layer is coated with a water repellent layer: the water repellent layer includes an organic sulfur compound that is mainly composed of a sulfide compound or a surfactant such as polyoxyethylene ethers: and a molded body that is formed by pressing the silver-coated conductive particles at a pressure of 14.7 MPa has a contact angle with water of 125 degree or more.
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International Classification(s)
- C23C:COATING METALLIC MATERIAL; COATING MATERIAL WITH M....
- C08J:WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTE....
- C09J:ADHESIVES; ADHESIVE PROCESSES IN GENERAL
- C09D:COATING COMPOSITIONS, e.g. PAINTS, VARNISHES, LACQ....
- H01B:CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATER....
- C08K:USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUB....
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