Indium-tin-silver based lead free solder
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United States of America Patent
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May 29, 2018
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May 12, 2016
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May 15, 2015
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Abstract
Indium-tin-silver alloys suitable for use as a lead free solder are described herein. The alloys may comprise primarily indium or comprise primarily tin. The alloys may further include copper, nickel, and iron or copper, antimony, and zinc. The composition can be used to solder an electrical connector to an electrical contact surface on a glass component. Methods of forming the alloys are also described herein.
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