Printed circuit board having a circular signal pad surrounded by a ground pad and at least one recess section disposed therebetween
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United States of America Patent
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May 22, 2018
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N/A
app pub date -
Sep 11, 2014
filing date -
Sep 24, 2013
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Abstract
To provide a printed board that solves the problem of transmission characteristics deterioration, the disclosed printed board includes a substrate, a circular signal pad that is provided on the substrate, a doughnut-shaped ground pad, which sandwiches the substrate that surrounds, in a doughnut shape, the signal pad, and which surrounds the outer circumference of the substrate, and one or more recessed sections that are disposed on the substrate that surrounds, in the doughnut shape, the signal pad.
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