Light-emitting diode package structure having plane light source and method for manufacturing the same
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United States of America Patent
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May 22, 2018
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May 10, 2017
filing date -
Mar 31, 2017
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Abstract
The present invention provides a light-emitting diode (LED) package structure and the method for manufacturing the same. First, a ceramic substrate is provided. Then, an ultraviolet (UV) LED chip, a light-guiding layer, and a metal reflective layer are disposed on the substrate sequentially. By means of the metal reflective layer, the emission light of the UV LED from the light-emitting side is reflected laterally and thus making the UV LED package structure output a plane light source.
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