Pads and pin-outs in three dimensional integrated circuits

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United States of America Patent

PATENT NO 9978773
SERIAL NO

15620142

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Abstract

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A three dimensional semiconductor device, comprising: a substrate including a plurality of circuits; a plurality of pads, each pad coupled to a circuit; and a memory array positioned above or below the substrate and coupled to a circuit to program the memory array.

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Patent Owner(s)

Patent OwnerAddress
LIBERTY PATENTS LLC2325 OAK ALLEY TYLER TX 75703

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Madurawe, Raminda Udaya Sunnyvale, US 83 5960

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