Sub-terahertz/terahertz interconnect

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United States of America Patent

PATENT NO 9978676
SERIAL NO

15167796

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Abstract

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An interconnect is described that comprises an interconnect channel, and two channel couplers coupled to the two ends of the interconnect channel through respective stoppers that provide a gap between the channel couplers and the interconnect channel. Each channel coupler can comprise a coplanar waveguide, a microstrip line, and a patch-antenna based coupler. The interconnect can enable communication between integrated circuits using signal waves having a frequency between 100 GHz and 3 THz.

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Patent OwnerAddress
THE REGENTS OF THE UNIVERSITY OF CALIFORNIA1111 FRANKLIN STREET FIFTH FLOOR OAKLAND CA 94607-5200

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Gu, Qun Davis, US 39 129
Liu, Xiaoguang Davis, US 36 95
Luhmann,, Jr Neville C Walnut Creek, US 2 9
Yu, Bo Davis, US 288 1714

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