Semiconductor method and associated apparatus
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United States of America Patent
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May 22, 2018
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app pub date -
Jun 1, 2016
filing date -
Jun 1, 2016
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Abstract
A semiconductor method is disclosed. The semiconductor method is performed upon semiconductor wafers, wherein each of the semiconductor wafers includes a first exposure field and a second exposure field, and each of the first exposure field and the second exposure field includes a first alignment mark and a second alignment mark. The method includes: determining a first alignment pattern for a first wafer by selecting one of the alignment marks of the first exposure field, and selecting one of the alignment marks of the second exposure field; performing the aligning operation upon the first semiconductor wafer by using the first alignment pattern; determining a second alignment pattern for a second wafer by selecting one of the alignment marks of the first exposure field, and selecting one of the alignment marks of the second exposure field, wherein the first alignment pattern is different from the second alignment pattern.
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