Wafer probe alignment

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United States of America Patent

PATENT NO 9977053
SERIAL NO

15176681

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Abstract

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A wafer probe alignment system and method for aligning a probe to a chip wafer for testing a chip on the wafer are provided. At least two corners of the probe are adjustable in a same direction in relation to a primary corner of the probe. The alignment approach includes providing a grid of signal pins for corresponding contact pads of the chip under test, determining for each signal pin whether an electrical contact is established to a corresponding contact pad of the chip under contact force, and adjusting a position of each of the at least two corners by a corner individual delta position value with respect to the direction depending on a result of the determining in order to establish an electrical contact between each of the pins and the corresponding contact pads of the chip under test.

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Patent Owner(s)

Patent OwnerAddress
INTERNATIONAL BUSINESS MACHINES CORPORATIONNEW ORCHARD ROAD ARMONK NY 10504

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Appinger, Joerg G Boeblingen, DE 2 28
Dengler, Eberhard Boeblingen, DE 3 38
Dieterle, Roland Holzgerlingen, DE 30 294
Eckert, Martin Boeblingen, DE 67 597
Kuczera, Gabriele Boeblingen, DE 4 39
Tomaschko, Siegfried Boeblingen, DE 11 78
Torreiter, Otto Boeblingen, DE 14 152
Trianni, Quintino Lorenzo Boeblingen, DE 6 42

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