Ultrasonic device, method for manufacturing the same, probe, and electronic apparatus

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United States of America Patent

PATENT NO 9976992
SERIAL NO

14807108

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Abstract

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An ultrasonic device that has high accuracy with respect to frequency and sensitivity and that can achieve a reduction of crosstalk is provided. A substrate of an ultrasonic device has a first surface and a second surface on a side opposite to the first surface, and has a first opening and a second opening that are separated from each other by a wall portion. A first vibration film and a second vibration film that close the first opening and the second opening, respectively, are disposed on the first surface of the substrate. A first piezoelectric element and a second piezoelectric element are provided on the first vibration film and the second vibration film, respectively. A recess that opens in the second surface of the substrate is demarcated in the wall portion.

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Patent Owner(s)

Patent OwnerAddress
SEIKO EPSON CORPORATIONTOKYO 160-8801

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Matsuda, Hiroshi Gifu, JP 474 5592

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