Method and structure of MEMS PLCSP fabrication
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United States of America Patent
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May 22, 2018
Issued Date -
N/A
app pub date -
Jul 11, 2017
filing date -
Jun 30, 2014
priority date (Note) -
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status (Latency Note)
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Abstract
A method and structure for a PLCSP (Package Level Chip Scale Package) MEMS package. The method includes providing a MEMS chip having a CMOS substrate and a MEMS cap housing at least a MEMS device disposed upon the CMOS substrate. The MEMS chip is flipped and oriented on a packaging substrate such that the MEMS cap is disposed above a thinner region of the packaging substrate and the CMOS substrate is bonding to the packaging substrate at a thicker region, wherein bonding regions on each of the substrates are coupled. The device is sawed to form a package-level chip scale MEMS package.
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International Classification(s)
- H01L:SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICE....
- G01L:MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL ....
- B81C:PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE M....
- B81B:MICRO-STRUCTURAL DEVICES OR SYSTEMS, e.g. MICRO-ME....
- G01P:MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, D....
- G01C:MEASURING DISTANCES, LEVELS OR BEARINGS; SURVEYING....
- G01R:MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC V....
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