Method for ultrasonic welding with particles trapping

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United States of America Patent

PATENT NO 9975194
SERIAL NO

15067779

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Abstract

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The present invention relates to a method of connecting two components by ultrasonic welding for producing a power semiconductor module, said method comprising the steps of: a) Aligning the components to be welded to form a welding interface; b) Aligning a welding tool to the aligned components; c) Removably arranging a trapping material at least partly encompassing the welding interface, whereby the trapping material is a foam; and d) Connecting the components by activating the welding tool. The method like described above provides an easy and cost-saving measure in order to prevent particle contamination when performing a welding process such as particularly an ultrasonic welding process sue to scattered particles.

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Patent Owner(s)

Patent OwnerAddress
HITACHI ENERGY LTDBROWN-BOVERI-STRASSE 5 ZÜRICH 8050

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Guillon, David Vorderthal, CH 12 19
Hartman, Samuel Staufen, CH 1 0
Sivasubramaniam, Venkatesh Aesch, CH 3 2
Thut, Markus Seon, CH 3 7
Trüssel, Dominik Bremgarten, CH 9 19

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Citation count rangeNumber of patents cited in rangeNumber of patents cited in various citation count ranges834979461962301 - 1011 - 2021 - 3031 - 4041 - 5061 - 7005010015020025030035040045050055060065070075080085090095010001050

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