Optoelectronic assembly and method for producing an optoelectronic assembly
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United States of America Patent
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May 15, 2018
Issued Date -
N/A
app pub date -
Jan 30, 2014
filing date -
Apr 4, 2013
priority date (Note) -
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Abstract
Various embodiments may relate to an optoelectronic assembly, including a printed circuit board, which has a first and a second sides, a central cutout, at least one contact cutout and, at least one connection location, a carrier element coupled to the printed circuit board, has a first side and at least one contact location, at least one optoelectronic component arranged on the first side of the carrier element in such a way that it is exposed in the central cutout of the printed circuit board, a housing body, which has a central cutout and which is formed and physically coupled to the printed circuit board such that the optoelectronic component is exposed in the central cutout, and at least one contact element arranged on an inner side of the housing body is formed such that the contact element electrically couples the contact location of the carrier element to the connection location.
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