Measurement method, manufacturing method of device, and measurement system
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United States of America Patent
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May 15, 2018
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N/A
app pub date -
Aug 31, 2016
filing date -
Mar 10, 2016
priority date (Note) -
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Abstract
According to one embodiment, there is provided a measurement method. The method includes measuring an amount of overlay shift between a first layer and a second layer using a first overlay mark and a second overlay mark. The first layer is provided as a layer including the first overlay mark above a first substrate. The second layer is provided as a layer including the second overlay mark above the first overlay mark. The method includes acquiring a parameter related to asymmetry of a shape of the second overlay mark. The method includes obtaining an amount of correction with respect to a measured value of the amount of overlay shift based on the acquired parameter and the measured amount of overlay shift.
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