Method of wrapping mica paper on an electrical conductor and mica paper tape suitable for same
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United States of America Patent
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May 15, 2018
Issued Date -
Dec 15, 2016
app pub date -
May 4, 2016
filing date -
Jun 12, 2015
priority date (Note) -
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Abstract
A method is disclosed of applying a mica paper around an electrical conductor, the process including attaching the tape comprising the mica paper to the conductor at an attachment point on the conductor; winding the tape around the conductor surface until the tape has been wound to a point that is at least 25 percent of the conductor circumference from the attachment point and then initiating a continuous removal of the support layer from the tape, starting at the attachment point; the mica paper remaining in contact with the surface of the conductor; and continuing to wind the tape around the conductor while simultaneously removing the support layer at a removal point until a desired amount of conductor surface is completely covered with at least one layer of the mica paper, with the proviso that the removal point is maintained at least 25 percent of the conductor circumference behind the winding point until the desired amount of conductor surface is completely covered.
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