Copper alloy and copper alloy sheet

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United States of America Patent

PATENT NO 9970081
APP PUB NO 20160222489A1
SERIAL NO

15021012

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Abstract

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Provided is a copper alloy containing 18% by mass to 30% by mass of Zn, 1% by mass to 1.5% by mass of Ni, 0.2% by mass to 1% by mass of Sn, and 0.003% by mass to 0.06% by mass of P, the remainder including Cu and unavoidable impurities. Relationships of 17≤f1=[Zn]+5×[Sn]−2×[Ni]≤30, 14≤f2=[Zn]−0.5×[Sn]−3×[Ni]≤26, 8≤f3={f1×(32−f1)}1/2×[Ni]≤23, 1.3≤[Ni]+[Sn]≤2.4, 1.5≤[Ni]/[Sn]≤5.5, and 20≤[Ni]/[P]≤400 are satisfied. The copper alloy has a metallographic structure of an α single phase.

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Patent Owner(s)

Patent OwnerAddress
MITSUBISHI SHINDOH CO LTDTOKYO TOKYO METROPOLIS

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Hokazono, Takashi Osaka, JP 8 23
Nakasato, Yosuke Kitamoto, JP 19 53
Oishi, Keiichiro Osaka, JP 78 383

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