MEMS packages and methods of manufacture thereof
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United States of America Patent
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May 15, 2018
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app pub date -
May 29, 2015
filing date -
May 29, 2015
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Abstract
Microelectromechanical systems (MEMS) packages and methods of manufacture thereof are described. In an embodiment, a method of manufacturing a MEMS package may include attaching a MEMS structure having a capping structure thereon to a device wafer comprising a plurality of first devices formed therein to form a wafer level MEMS package; and singulating the device wafer having the MEMS structure attached thereto to form a plurality of chip scale MEMS packages.
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