Aluminum-tin paste and its use in manufacturing solderable electrical conductors
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United States of America Patent
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May 8, 2018
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app pub date -
May 18, 2015
filing date -
Jun 12, 2014
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Abstract
The present invention is directed to a paste composition comprising Al and Sn dispersed in an organic medium and to paste compositions that provide a solderable electrode. The present invention is further directed to an electrode formed from the paste composition and a semiconductor device and, in particular, a solar cell comprising such an electrode. The paste compositions that provide a solderable electrode are particularly useful for forming a solar cell back side solderable electrode.
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