Pick-and-place tool for packaging process
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United States of America Patent
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May 8, 2018
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N/A
app pub date -
Jul 28, 2015
filing date -
Nov 7, 2011
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Abstract
A method includes moving a first bond head along a first guide apparatus for a first loop. The first guide apparatus is configured in a ring shape. The method also includes picking up a first die using the first bond head during the first loop, and aligning the first die with a first package substrate. The aligning the first die with the first package substrate includes moving the first package substrate in a first direction and a second direction. The first direction and the second direction are contained in a first plane parallel to the first loop. The method further includes placing the first die over the first package substrate during the first loop.
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