Thermopile differential scanning calorimeter sensor
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United States of America Patent
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May 8, 2018
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app pub date -
Mar 20, 2014
filing date -
Mar 22, 2013
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Abstract
A heat flow sensor for a heat flux differential scanning calorimeter comprising twin thermopiles. The thermopiles each comprise positive and negative thermocouple alloys and electrically insulating ceramic components. Diffusion bonding is used to form thermocouple junctions in the thermopiles between the positive and negative thermocouple elements, and to attach the thermocouple elements to the ceramic components.
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