Hot press formed parts having excellent powdering resistance during hot press forming
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
May 8, 2018
Issued Date -
N/A
app pub date -
Aug 29, 2016
filing date -
Dec 24, 2014
priority date (Note) -
In Force
status (Latency Note)
![]() |
A preliminary load of PAIR data current through [] has been loaded. Any more recent PAIR data will be loaded within twenty-four hours. |
PAIR data current through []
A preliminary load of cached data will be loaded soon.
Any more recent PAIR data will be loaded within twenty-four hours.
![]() |
Next PAIR Update Scheduled on [ ] |

Importance

US Family Size
|
Non-US Coverage
|
Patent Longevity
|
Forward Citations
|
Abstract
Provided is a hot press-formed (HPF) member with excellent powdering resistance at the time of press forming. The HPF member includes a hot-dip coating layer containing Al on a surface of a base steel sheet. The base steel sheet includes, based on wt %, 0.18-0.25% of C, 0.1-1.0% of Si, 0.9-1.5% of Mn, 0.03% or less of P, 0.01% or less of S, 0.01-0.05% of Al, 0.05-0.5% of Cr, 0.01-0.05% of Ti, 0.001-0.005% of B, 0.009% or less of N, the balance Fe, and the other impurities. The hot-dip coating layer comprises a soft diffusion layer and a hard alloy layer. The alloy layer has a Tau phase in the range of 10-30%, in terms of area percent.
First Claim
all claims..Other Claims data not available
Family

- 15 United States
- 10 France
- 8 Japan
- 7 China
- 5 Korea
- 2 Other
Patent Owner(s)
Patent Owner | Address | |
---|---|---|
POSCO CO LTD | POHANG-SI GYEONGSANGBUK-DO 37859 |
International Classification(s)
Inventor(s)
Inventor Name | Address | # of filed Patents | Total Citations |
---|---|---|---|
Bae, Dae-Chul | Pohang-si, KR | 7 | 72 |
# of filed Patents : 7 Total Citations : 72 | |||
Kim, Heung-Yun | Gwangyang-si, KR | 14 | 71 |
# of filed Patents : 14 Total Citations : 71 | |||
Sohn, Il-Ryoung | Gwangyang-si, KR | 43 | 204 |
# of filed Patents : 43 Total Citations : 204 |
Cited Art Landscape
- No Cited Art to Display

Patent Citation Ranking
- 4 Citation Count
- C23C Class
- 32.86 % this patent is cited more than
- 7 Age
Forward Cite Landscape
- No Forward Cites to Display

Maintenance Fees
Fee | Large entity fee | small entity fee | micro entity fee | due date |
---|---|---|---|---|
7.5 Year Payment | $3600.00 | $1800.00 | $900.00 | Nov 8, 2025 |
11.5 Year Payment | $7400.00 | $3700.00 | $1850.00 | Nov 8, 2029 |
Fee | Large entity fee | small entity fee | micro entity fee |
---|---|---|---|
Surcharge - 7.5 year - Late payment within 6 months | $160.00 | $80.00 | $40.00 |
Surcharge - 11.5 year - Late payment within 6 months | $160.00 | $80.00 | $40.00 |
Surcharge after expiration - Late payment is unavoidable | $700.00 | $350.00 | $175.00 |
Surcharge after expiration - Late payment is unintentional | $1,640.00 | $820.00 | $410.00 |
Full Text

Legal Events
Date | Code | Event | Description |
---|---|---|---|
Nov 05, 2007 | STCH | INFORMATION ON STATUS: PATENT DISCONTINUATION | free format text: PATENT EXPIRED DUE TO NONPAYMENT OF MAINTENANCE FEES UNDER 37 CFR 1.362 |
Oct 07, 2007 | FP | LAPSED DUE TO FAILURE TO PAY MAINTENANCE FEE | Effective Date: Oct 07, 2007 |
Oct 07, 2007 | LAPS | LAPSE FOR FAILURE TO PAY MAINTENANCE FEES | |
Apr 25, 2007 | REMI | MAINTENANCE FEE REMINDER MAILED | |
Oct 07, 2003 | I | Issuance | |
May 30, 2002 | P | Published | |
Jan 07, 2002 | F | Filing | |
Jan 11, 2000 | PD | Priority Date |

Matter Detail

Renewals Detail
