Systems and methods for performing chemical mechanical planarization
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United States of America Patent
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May 8, 2018
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Jul 9, 2015
app pub date -
Jan 7, 2014
filing date -
Jan 7, 2014
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Abstract
Systems and methods are provided for performing chemical-mechanical planarization. An example system includes: a polishing head, a polishing pad, a slurry distribution component, and a reactant distribution component. The polishing head is configured to perform chemical-mechanical planarization on an article. The polishing pad is configured to support the article. The slurry distribution component is configured to provide a slurry on the polishing pad. The reactant distribution component is configured to provide an oxidizer material on the polishing pad to generate a plurality of radicals to react with the article.
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